Product
Introduction
3D CT AXI
3D CT AXI products combine three-dimensional X-ray computed tomography (CT) and automated X-ray inspection (AXI) to enable high-resolution, non-destructive inspection of the internal structure of semiconductor packages or printed circuit boards (PCBs).
- 특성
- High performance X-ray systems are used to reveal highly detailed internal structures in high resolution
- The internal structure of a component or package can be inspected without any physical damage to the product.
- It can handle packages and PCBs made from a variety of materials, offering a wide range of applications in the manufacturing process.
- The automated X-ray scanning and analysis process reduces inspection time and increases inspection accuracy.
- It quickly detects small defects or flaws to improve production quality and helps to analyze the cause of defects.
제품 상세 설명
X-ray inspection machine
A device that uses X-ray technology to inspect the internal structure of a semiconductor wafer or package without any damage.
It is used to detect microscopic defects or imperfections and to verify the quality of the product in the semiconductor manufacturing process.
Inline 3D CT AXI - 3Xi-M110
Achieve In-line in high speed
High-precision image acquisition for true 3D inspection
Benefits of inspection with proprietary PLANAR CT technology
The process of creating high-precision 3D data
The Planar CT method allows us to analyze images from different orientations using a proprietary algorithm, generating hundreds of high-precision tomograms. These tomograms are then stitched together to create a high-precision 3D data set.
By utilizing a high rigidity frame and a high accuracy linear scale, the position of each axis is acquired in real-time during acquisition and used for planar CT computation, enabling the acquisition of clean, high-precision stereoscopic images from end to end.
Separation in the Z-axis direction
High-precision images can be acquired that are unaffected by complex internal structures and shadows of reversed-mounted components.
High-accuracy 3D data scanning process
Dense real-time 3D inspection based on information along the entire X Y Z axis ensures that defects are not missed at any height.
2x faster speed without sacrificing inspection quality
Reduced FOVs with wide-area photography → Reduced Takt Time
The addition of wide-area photography-will enable faster in-lineable cycle times.
High-speed mathematical processing method
This innovative machine control technology integrates stage control and the acquisition process, enabling the completion of both tasks almost simultaneously