Product
Introduction
TB/DB,Detaper
제품문의
Debonder
Debonder is a tool used to safely remove semiconductor chips or other crucial components from a semiconductor device or circuit board. It is designed to remove and recycle parts without damaging the equipment.
- 특성
- Safely remove semiconductor components within electronic devices without damage
- Automated features speed up the process and reduce operator effort
- Safely remove components to facilitate recycling and increase resource recovery
- Fine-tuned to handle different types of semiconductor components
- Extend the equipment life of electronics and encourage the use of sustainable technologies while reducing costs
제품 상세 설명
TB / DB
In semiconductor design, a test block (TB) is a small block inserted into a chip to test and verify a specific function,
while a design block (DB) represents each unit of design required to implement the functionality of a static chip.
Debonder
Debonder is a device that separates SI or glass wafers bonded with materials other
than 3M materials using mechanical, UV, IR laser, and chemical solutions to separate the wafer from the carrier.
- Several installed base for Advanced Packaging debonding process
- Bumped wafer cleaning for each surface
- Thin wafer cleaning with dicing frame attached
- Chuck supporting bumped wafer
- Mechanical
- Simple and Effective solution
- Cost effective / Low CoO
- Smooth operation by sufficient controllable function
- Differential Pressure Debonder
- Debond the wafer and carrier using differential pressure and the initiator which achieves stress-free operation.