Product
Introduction
Loosely Held Abrasive pad
Loosely held abrasive pads are materials used in the process of polishing the surface of a wafer, primarily polyurethane-based abrasive pads.
- Feature
- High Abrasive Efficiency
- Long life expectancy
- High surface quality
- No need for grit sludge
Detailed Specification
LHA PAD
LHA PAD is an abrasive pad that improves droplet formation on wafer surfaces by applying low concentrations of material to the surface.
This improves manufacturing precision and efficiency by maintaining low contact angles and high surface energy throughout the process.
Loosely Held Abrasive pad
LHA PAD is an important tool used in grinding operations. Grain type, grain size,
and bonding are all factors that combine to determine the performance of an abrasive pad.
| Polishing Methods | Burr-Free grinding (standard process) |
Loosely Held Abrasive pad (LHA PAD) |
|
|---|---|---|---|
| Polishing Image |
|
|
|
| Feature | Abrasiveness | ○ | ◎ |
| Surface Quality | △ ~ ○ | ◎ | |
| Period of Use | △ | ○ | |
| Adjustability | ○ | △ | |
| Consumable | Polishing fluid | X ~ △ With burrs | ○ Without burrs |
- Fast
- than Fast
1.7 times more efficient
than conventional products
- More
- than More
Power of high efficiency grinding
- Quality
- better Quality
High surface quality
Reducing environmental impact by removing sludge
-
Burr-Free grinding
(standard process)
-
Loosely Held Abrasive pad
(LHA PAD)
6inch
Complete
8inch
Complete