PCB Manufacturing Plant
Business
Utilizing the world's first LASER DRILL device developed by SUMITOMO
for the printed circuit board VIA HOLE processing business, we prioritize customer support
by processing ultra-fine holes and developing and utilizing applications that meet various customer needs.
Our quality control and processing technologies are suitable for use with a range of high-tech products,
including mobile phones, advanced AI, automobiles and laptops. These products are based on our extensive
experience and expertise in special printed circuit boards and semiconductor PKG.
We will continue to do our best to develop advanced machining methods. Thank you.
Certification
-
- 2004
- - Acquirement of ISO 9001 : 2015 certificate
-
- 2008
- - Acquirement of ISO 14001 : 2015 certificate
-
- 2022
- - Acquirement of IATF 16949 : 2016 certificate
Featured customers
Machine fleet and specifications
| Maker |
|
A社 | |
|---|---|---|---|
| Item | SLR-700T G III S (HOLD 10SETS) | SLR-710T G IV S(HOLD 1SETS) | A- Company (I -Type) |
| Outer dimension (mm) | 3,830*1,980 | 5,700*4,600 | 4,240*2,370 |
| Slot Area (㎡) | 7.6 | 7.6 | 10 |
| Hole Size |
|
|
← |
| Work Size (Head) | 640*534(2) | 640*534(2) | 635*813(2) |
| Laser Power | 450w or more | 440w or more | 500w or more |
| Power Stability (%) | 5이하 | Power Stability (%) | ← |
| Laser Freq (hz) | 3,000 | 5,500 | ← |
| Gavano Freq (hz) | 3,300 | 4,000 | ← |
| Positioning Accuracy | ±10㎛ | ← | ← |
| Beam mode |
Gaussian, Top-Hat, Multi ( 3 Mode ) 
|
Gaussian , Top-HAT (2 Mode) | |
| Modulation Pulse | Enable | ← | ← |
| Scan Area (mm) | HDI 50*50 , PKG 30*30 | HDI 40*40 , PKG 25*25 | HDI 70*70 , PKG 30*30 |
| Ftheta lens | 3.75inch | 3inch | 3.5inch |
|
Processing Time
BVH (Cu + Resin + Base Cu) 700,000 holes (2㎛ +40㎛ + 5㎛) |
470sec | 435sec | 482sec |
Machine productivity comparison
| Maker |
|
||
|---|---|---|---|
| Item | SLR-700T G III (HOLD 10SETS) | SLR-710T G IV (HOLD 1SETS) | SLR-800T (HOLD 0SET) |
| Panel Size (mm) | 534*640 | 534*640 | 534*640 |
| Shot Number / Hole (shots) | 2 | 2 | 2 |
| Process (mode) | Cycle | Cycle | Cycle |
| Galvano Scan Area (mm) | 30*30 | 30*30 | 25*25 |
| Number of Scanning (times) | 39 | 39 | 39 |
| Area to Area move time (sec) | 0.25 | 0.21 | 0.25 |
| Laser Frequency (Hz) | 10,000*2 | 10,000*2 | 10,000*2 |
| (MAX Rep rate) (Hz) | (20,000*2) | (20,000*2) | (20,000*2) |
| Actual Galvo Frequency (1.5 mm Pitch) (Hz) |
3,100*2 | 3,600*2 | 4,000*2 |
| (MAX Frequency) (Hz) | (3,300*2) | (4,000*2) | (5,000*2) |
| Loading / Unloading Time (sec) | 10 | 10 | 10 |
| Alignment time (4points) (sec) | 5 | 4.5 | 4.5 |
| XY Table area-area move time (sec) |
4.9 | 4.3 | 4 |
| Galvo Work time (sec) | 64.5 | 61.5 | 59.5 |
| Hole Size (sec) |
|
|
|
| Total Process Time (sec) | 84.4 | 74.1 | 73.8 |
Photos of production facilities
