Product
Introduction
Romulus
Romulus is a computer-controlled tester for strength testing and evaluation of various material surfaces such as thin films in the semiconductor manufacturing process. It maximizes the efficiency of semiconductor production through high accuracy and reliability.
- Feature
- Interchangeable measurement modules
- Quantitative measurement
- Adhesion force up to approximately 700kg/㎠
- Maximum tensile force load up to 100kg (optionally up to 200kg)
- Set simple measurement conditions and display measurement results using dedicated software
Detailed Specification
Stud Pin
Stud pins are small metal pins that electrically connect the chip and substrate within a semiconductor package.
They provide high conductivity and stability, improving the performance and reliability of semiconductor devices.
Romulus
Romulus is a computer-controlled tester for strength testing and evaluation of various material surfaces including thin films.
It is a world standard device that can easily evaluate the bond strength of various types of surfaces,
such as bond strength measurement, microelectronics process control in thin film manufacturing,
material properties inspection and various coating film tests.
In the 1980s, Quad Group of the United States developed the Sebastian, a Romulus electric model, which attracted attention as an adhesion strength tester by tensile force testing using proprietary epoxy adhesive and stud pins. In recent years, there has been a notable increase in the use of various thin films, driven by advances in semiconductor technology, the multilayering of printed circuit boards, and the high performance of thin-film TVs and digital devices. As the need to measure the adhesion strength of thin films, which is an important mechanical property, has increased, various types of testers have emerged. However, the Romulus is the optimal choice for measuring the adhesion strength of various thin films. It is the most accurate and simplest to set up, preserve, and display measurement parameters by computer control.
- Measurement target
- Adhesion strength of thin films such as color filters, register films, low-k films, thin film solar cells, oxide films, plating films, DLC films.
- Adhesion strength of composite substrates
- Attraction strength of coating film
- Shear strength measurement of fixed die
- Peel strength of flexible substrates (Peel Test)
Thin film adhesion test
The Romulus is the only device on the market designed specifically for stud pull peel strength testing. Stud Pull peel strength testing is an automated tensile test that employs a Pull-Down Breaking Point Platform. As illustrated in the accompanying schematic, the tester applies a load to the sample by tensioning the stud pin in a vertical direction, causing the sample to pull down on the support. This results in the ultimate delamination occurring at the weakest point. The tester displays the load at the point of delamination. If the peel is localized and occurs between the substrate and the film, the load at peel will be the adhesion force of the film. One of the key benefits of using this tester is that the measurement results remain consistent even if multiple testers are used. The measurement itself is straightforward and convenient for many users, and it is used to measure the adhesion of various thin films and composite materials.
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Pull Down Breaking Point Test 
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The measurement consists of the main unit, computer and LCD monitor.
It can be powered by two 100V AC connections.