Product
Introduction
TB/DB,Detaper
Product Inquiry
Mounter
The Mounter is a piece of equipment that accurately mounts dies onto wafers or packages in the semiconductor manufacturing process. It uses high-precision positioning and bonding technology to ensure accurate placement of semiconductor devices.
- Feature
- Minimize the risk of cross-contamination by processing on a single wafer basis.
- The process can be controlled independently for each wafer, resulting in consistent cleaning quality
- The precise cleaning process effectively removes contaminants from the wafer surface
- Different process conditions can be adjusted as required, which is advantageous when processing different types of wafers
- Optimized processes can be applied to individual wafers, increasing overall process efficiency
Detailed Specification
TB / DB
In semiconductor design, a test block (TB) is a small block inserted into a chip to test and verify a specific function,
while a design block (DB) represents each unit of design required to implement the functionality of a static chip.
Mounter
The Mounter is a key piece of semiconductor manufacturing equipment
for the glass wafer bonding process using 3M material to join two wafers into a single structure.
- Non-Thermal Process
- Room temperature process by using UV curable adhesive for mounting.
- Increasing yield from excluding heat and pressure affect when mounting.
- High Throughput
- Adhesive curable less than a minute from high output UV irradiation.
- Reaching more than 25WPH.
- Low CoO
- Chamber unnecessary due to no high heat/pressure process.
- Reusable system for spined out adhesive.
