Product
Introduction
TB/DB,Detaper
Product Inquiry
Bonder
Bonder is a device that accurately mounts a die on a wafer or package in the semiconductor manufacturing process. It uses high-precision positioning and bonding technology to ensure the precise placement of semiconductor devices.
- Feature
- Minimize the risk of cross-contamination by processing on a single wafer basis.
- The process can be controlled independently for each wafer, resulting in consistent cleaning quality
- The precise cleaning process effectively removes contaminants from the wafer surface
- Different process conditions can be adjusted as required, which is advantageous when processing different types of wafers
- Optimized processes can be applied to individual wafers, increasing overall process efficiency
Detailed Specification
TB / DB
In semiconductor design, a test block (TB) is a small block inserted into a chip to test and verify a specific function,
while a design block (DB) represents each unit of design required to implement the functionality of a static chip.
Bonder
Bonder is an important semiconductor manufacturing equipment for SI or glass wafer bonding process using
materials other than 3M material to join two wafers into a single structure.
| Item | Specification |
|---|---|
| Size | 12inch |
| Alignment accuracy | X - Y : + / -30μm |
| Bonding pressure | ~40kN |
| Stage specification | Electro static chuck: heat temp. Max. 250ºC |
| Vacuum pressure | < 20Pa |
| TTV | < 5% (adhesive uniformity) |