Product
Introduction
TB/DB,Detaper
Product Inquiry
Detaper
Detaper is a piece of equipment used in the semiconductor manufacturing process that separates each chip individually from the semiconductor wafer.
- Feature
- It can accurately separate each chip, making it efficient in manufacturing processes that require a high degree of precision
- Automated operations improve productivity and keep production lines moving by quickly separating semiconductor chips
- Quality control can be performed accurately, reducing defects during manufacturing and improving the quality of the final product
- Resources can be conserved in the semiconductor manufacturing process and materials and labor can be managed efficiently
- Provide flexibility to accommodate different wafer sizes and different semiconductor chip designs.
Detailed Specification
Detaper
It is mainly performed after the grinding and polishing of the wafer and is very important
to maintain the quality of the wafer and avoid problems in subsequent processes.
Detaper (Tape Remover)
It is mainly performed after the grinding and polishing of the wafer and is very important
to maintain the quality of the wafer and avoid problems in subsequent processes.
- Dry Process
- No solvent required
- No cleaning required after detape
- No cleaning process required after debonding.
- Simple Tool
- Simple tool configuration
- No wet process required.
- Others
- Heating Function can be installed
- Equipment configuration can be changed according to production volume requirements - 1 lane or 2 lane type